TechStore Inks Underwriting Agreement With M&A Securities For Upcoming IPO

KUALA LUMPUR, Jan 6 (Bernama) -- Information technology (IT) services provider, TechStore Bhd (TechStore) has signed an underwriting agreement with M & A Securities Sdn Bhd for its upcoming initial public offering (IPO) on the ACE Market of Bursa Malaysia.

Details
Published Date
6 Jan 2025 at 12:34 PM
Publisher
Bernama
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